-
Copper Substrate PCB no ke kukui o waho
Hoʻokahi papa papa, ka mānoanoa o ka papa:2.0mm;
ʻO ka mānoanoa keleawe i pau: 35um,
Hoʻopau: ENIG
-
5.0W/MK High Thermal Conductivity MCPCB No ke kukui ʻāina
ʻAno metala: Ke kumu alumini
Ka helu o nā papa: 1
Ili:ENIG
-
8.0W/mk kiʻekiʻe thermal conductivity MCPCB no ka uila uila
ʻAno metala: Ke kumu alumini
Ka helu o nā papa: 1
Ili: Ke alakaʻi manuahi HASL
Ka mānoanoa o ka pā: 1.5mm
Ka mānoanoa keleawe: 35um
ʻO ka wela wela: 8W/mk
Kū'ē wela: 0.015 ℃/W
-
ʻO FPC hiki ke hoʻopaʻa ʻia me ka FR4
ʻAno mea: polyimide
Helu papa: 2
Min laula me ka lewa: 4 mil
Ka nui o ka lua min: 0.20mm
ʻO ka mānoanoa o ka papa i pau: 0.30mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: ʻulaʻula
Ka manawa alakaʻi: 10 mau lā
-
6 papa impedance control papa ʻoʻoleʻa me ka ʻoʻoleʻa
ʻAno mea: FR-4, polyimide
Min laula me ka lewa: 4 mil
Ka nui o ka lua min: 0.15mm
ʻO ka mānoanoa o ka papa i pau: 1.6mm
FPC mānoanoa: 0.25mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: ʻulaʻula
Ka manawa alakaʻi: 20 mau lā
-
Puka hoʻokuʻu ʻia ʻo Resin Microvia Immersion kala HDI me ka wili ʻana laser
ʻAno mea: FR4
Helu papa: 4
Min laula me ka lewa: 4 mil
Ka nui o ka lua min: 0.10mm
ʻO ka mānoanoa o ka papa i pau: 1.60mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: uliuli
Ka manawa alakaʻi: 15 mau lā
-
3 oz solder mask e hoʻopili ana i ka ENEPIG papa keleawe kaumaha
Hoʻohana nui ʻia ʻo Heavy Copper PCB i nā ʻōnaehana Power Electronics a me nā ʻōnaehana Power Supply kahi i loaʻa ai kahi koi kiʻekiʻe o kēia manawa a i ʻole kahi hiki ke pana koke i ka hewa o kēia manawa.Hiki i ke kaumaha keleawe ke hoʻololi i kahi papa PCB nāwaliwali i kahi paʻa paʻa, hilinaʻi, a lōʻihi hoʻi ka hoʻopaʻa ʻana i ka pono o nā mea ʻoi aku ka nui a me ka nui e like me Heat sinks, fans, etc.
-
wikiwiki multilayer High Tg Papa me ke gula immersion no ka modem
ʻAno mea: FR4 Tg170
Helu papa: 4
Min laula me ka hakahaka: 6 mil
Ka nui o ka lua min: 0.30mm
ʻO ka mānoanoa o ka papa i pau: 2.0mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: ʻōmaʻomaʻo"
Ka manawa alakaʻi: 12 lā
-
ʻaoʻao hoʻokahi ʻaoʻao immersion gula Ceramic Board based
ʻAno mea: kumu seramika
Ka helu papa: 1
Min laula me ka hakahaka: 6 mil
Ka nui o ka lua min: 1.6mm
Ka mānoanoa o ka papa i pau: 1.00mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: uliuli
Ka manawa alakaʻi: 13 mau lā
-
Haʻahaʻa Volume lapaʻau PCB SMT Hui
ʻO SMT ka pōkole no Surface Mounted Technology, ka ʻenehana kaulana loa a me ke kaʻina hana i ka ʻoihana hui uila.Ua kapa ʻia ka ʻenehana uila ʻo Surface Mount Technology (SMT) ʻo Surface Mount a i ʻole Surface Mount Technology.He ʻano o ka ʻenehana hui Circuit e hoʻokomo i nā ʻāpana hui alakaʻi alakaʻi ʻole a pōkole paha (SMC/SMD ma ka ʻōlelo Kina) ma ka ʻili o ka Printed Circuit Board (PCB) a i ʻole kahi substrate surface, a laila welds a hōʻuluʻulu ma o ka reflow welding a i ʻole. kuʻi wili.
-
huli wikiwiki prototype gula plating PCB me Counter poho lua
ʻAno mea: FR4
Helu papa: 4
Min laula me ka hakahaka: 6 mil
Ka nui o ka lua min: 0.30mm
ʻO ka mānoanoa o ka papa i pau: 1.20mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu pale pale: ʻōmaʻomaʻo"
Ka manawa alakaʻi: 3-4 mau lā
-
1.6mm wikiwiki prototype maʻamau FR4 PCB
ʻAno mea: FR-4
Helu papa: 2
Min laula me ka hakahaka: 6 mil
Ka nui o ka lua min: 0.40mm
ʻO ka mānoanoa o ka papa i pau: 1.2mm
ʻO ka mānoanoa keleawe i pau: 35um
Hoʻopau: alakaʻi manuahi HASL
Ka waihoʻoluʻu pale pale: ʻōmaʻomaʻo
Ka manawa alakaʻi: 8 mau lā
