ʻO ka mea hana PCB hoʻokūkū

hoʻokahi papa immersion gula Ceramic hoʻokumu Papa

Hōʻike Pōkole:

Nā ʻano pono: kumu pālolo

Helu papa: 1

Min laulā ākea / hakahaka: 6 mil

Ka nui o ka puka: 1.6mm

Pau ka mānoanoa o ka papa: 1.00mm

Pau ka mānoanoa keleawe: 35um

Pau: ENIG

ʻO ka waihoʻoluʻu mask mask: polū

Ka manawa alakaʻi: 13 mau lā


ʻIke kikoʻī

Nā huahana huahana

Nā ʻano pono: kumu pālolo

Helu papa: 1

Min laulā ākea / hakahaka: 6 mil

Ka nui o ka puka: 1.6mm

Pau ka mānoanoa o ka papa: 1.00mm

Pau ka mānoanoa keleawe: 35um

Pau: ENIG

ʻO ka waihoʻoluʻu mask mask: polū

Ka manawa alakaʻi: 13 mau lā

ceramic based board

ʻO ke kumulāʻau ceramic e pili ana i ka pepa keleawe ma ke ana wela kiʻekiʻe i hoʻopili pono ʻia i ka aluminika oxide (Al2O3) a i ʻole ka aluminika nitride (AlN) pālolo substrate pā (hoʻokahi a pāpālua paha) papa hana kūikawā. ʻO ka substrate ultra-lahilahi substrate he hana uila uila maikaʻi, conductivity wela kiʻekiʻe, waiwai brazing palupalu maikaʻi a me ka ikaika adhesion kiʻekiʻe, a hiki ke hoʻopaʻa i nā kiʻi like ʻole e like me ka papa PCB, me ka hiki ke lawe i kēia manawa. No laila, ua lilo ka substrate pālolo i mea waiwai o ka ʻenehana uila uila kiʻekiʻe a me ka ʻenehana pili.

Ka maikaʻi o ka papa ceramic:

Ikaika koʻikoʻi koʻikoʻi, kūpaʻa kinona; Ka ikaika kiʻekiʻe, conductivity mehana kiʻekiʻe, hoʻokiʻekiʻe kiʻekiʻe; Hoʻohui ikaika, anti - ka popopo.

◆ ʻO ke kaʻina hana uila maikaʻi, nā manawa pōʻaiapili a hiki i ka 50,000 mau manawa, hilinaʻi kiʻekiʻe.

◆ Hiki ke kahakaha ʻia ke ʻano o nā kiʻi like ʻole me PCB (a i ʻole IMS substrate); ʻAʻohe haumia, ʻaʻohe haumia.

◆ ʻO ka mahana lawelawe he -55 ℃ ~ 850 ℃; ʻO ka coefficient hoʻonui hoʻonui pumehana kokoke i ka silikone, kahi mea maʻalahi i ke kaʻina hana o ka module mana.

ʻO ka noi o ka papa ceramic:

ʻO nā substrates pālolo (alumina, aluminika nitride, silikone nitride, zirconia a me zirconia toughening alumina ʻo ia hoʻi ʻo ZTA) ma muli o kāna thermal, mechanical, chemicals, a me nā dielectric maikaʻi, hoʻohana nui ʻia i ka semipondoror chip packaging, sensors, uila uila, kelepona paʻalima a me nā pae naʻauao ʻē aʻe, nā mea kani a me nā mika, ka ikehu hou, kumu kukui hou, ke kaʻa uila wikiwiki wikiwiki, ka mana o ka makani, robotics, aerospace a me nā pūʻali koa pale kaua a me nā ʻenehana kiʻekiʻe ʻē aʻe. Wahi a nā helu helu, ʻo kēlā me kēia makahiki ka waiwai substrate pālolo i hiki aku i ka ʻumi mau piliona o ka mākeke, keu hoʻi i nā makahiki i hala aku nei, me ka ulu wikiwiki ʻana o Kina i nā kaʻa ikehu hou, ke kaʻa uila wikiwiki a me nā kahua kahua 5 g, nui ka makemake o ka substrate pālolo, i ke kaʻa wahi, ʻo ka nui o ka noi i kēlā me kēia makahiki a i 5 miliona PCS; ʻAʻole hoʻohana wale ʻia ka substrate pālolo Alumina i ka ʻoihana uila a me ka uila, akā i ka sensor pressure a me ka mālamalama hoʻoneʻe wela LED.

Hoʻohana ʻia i ka lā i ka 5 fars:

1.IGBT module no ke alahao wikiwiki, nā kaʻa ikehu hou, ka hanauna makani, robots a me nā kahua kahua 5G;

2.Smart kelepona backplane a me ka ʻike manamana lima;

3.New hanauna paʻa paʻa wahie aula;

4.New mīkini pā palahalaha a me ka oxygen sensor;

5.LD / LED dissipation wela, ʻōnaehana laser, kaapuni hoʻohui hybrid;


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    Nā Huahana Huahana

    E kia i ka hāʻawi ʻana i nā hāʻina mong pu no 5 mau makahiki.