Mea Hana PCB hoʻokūkū

ʻO ka pāpaʻi seramika e pili ana i ka foil keleawe ma ka wela kiʻekiʻe i hoʻopaʻa pono ʻia me ka alumini ʻokikene (Al2O3) a i ʻole ka alumini nitride (AlN) ka ʻili o ka pā seramika (hoʻokahi a i ʻole pālua).Loaʻa i ka ultra-thin composite substrate ka hana insulation uila maikaʻi loa, ka conductivity thermal kiʻekiʻe, ka waiwai brazing palupalu maikaʻi loa a me ka ikaika adhesion kiʻekiʻe, a hiki ke hoʻopaʻa i nā ʻano kiʻi like ʻole e like me ka papa PCB, me ka hiki ke halihali i kēia manawa.No laila, ua lilo ka ceramic substrate i mea kumu o ka ʻenehana hoʻolālā uila uila a me ka ʻenehana interconnection.

ʻO ka pōmaikaʻi o ka papa hana keramika:

ʻO ke koʻikoʻi mechanical ikaika, kūlana paʻa;Ka ikaika kiʻekiʻe, kiʻekiʻe thermal conductivity, kiʻekiʻe insulation;Pili ikaika, anti - corrosion.

◆ Hana maikaʻi i ka pōʻai wela, nā manawa pōkole a hiki i 50,000 mau manawa, hilinaʻi kiʻekiʻe.

◆ Hiki ke kālai ʻia ke ʻano o nā kiʻi like ʻole e like me PCB (a i ʻole IMS substrate);ʻAʻohe haumia, ʻaʻohe pollution.

◆ ʻO ka mahana lawelawe -55 ℃ ~ 850 ℃;ʻO ke koena hoʻonui wela e kokoke ana i ke silika, e hoʻomaʻamaʻa i ke kaʻina hana o ka module mana.

ʻO ka hoʻohana ʻana i ka papa seramika:

ʻO nā substrates seramika (alumina, alumini nitride, silicon nitride, zirconia a me ka zirconia toughening alumina ʻo ZTA) ma muli o kāna mau mea wela maikaʻi loa, mechanical, chemical, a me dielectric waiwai, ua hoʻohana nui ʻia i loko o ka puʻupuʻu semiconductor chip, sensors, communication electronics, mobile phones a 'ē aʻe naʻauao terminal, mea kani a me nā mika, ikehu hou, hou kumu kukui, kaʻa kiʻekiʻe-wikiwiki kaʻaahi, makani mana, robotics, aerospace a me ka pale kaua a me nā mea kiʻekiʻe-tech kahua.Wahi a nā helu helu, i kēlā me kēia makahiki, ua hiki i nā ʻumi piliona ka waiwai o ka mākeke, ʻoi aku ka nui o nā makahiki i hala iho nei, me ka ulu wikiwiki ʻana o Kina i nā kaʻa ikehu hou, nā kaʻa kaʻa kiʻekiʻe kiʻekiʻe a me nā kahua kahua 5 g, nui ka koi ʻana o ka substrate ceramic, ma ke kaʻa wale nō. wahi, ka nui koi i kēlā me kēia makahiki a hiki i 5 miliona PCS;ʻAʻole hoʻohana nui ʻia ka substrate seramika alumina i ka ʻoihana uila a me ka uila, akā pū kekahi i ka sensor kaomi a me ke kahua dissipation wela o LED.

Hoʻohana mua ʻia ma nā wahi 5 e hahai nei:

1.IGBT module no ke kaʻaahi kiʻekiʻe, nā kaʻa ikehu hou, ka mana makani, nā robots a me nā kahua kahua 5G;

2.Smart phone backplane a me ka ʻike manamana lima;

3.New hanauna paʻa wahie keena;

4. New flat plate pressure sensor and oxygen sensor;

5.LD/LED ka wela wela, laser system, hybrid integrated circuit;