ʻO ka mea hana PCB hoʻokūkū

Hoʻokaʻina 'ikamu Mea hiki maʻamau Mea hiki kūikawā

helu papa

PCB paʻa paʻa 2-14 2-24
  Flex PCB 1-10 1-12

papa

  0.08 +/- 0.03mm 0.05 +/- 0.03mm
  Min. Mānoanoa    
  Max. Mānoanoa 6mm 8mm
  Max. Nui 485mm * 1000mm 485mm * 1500mm
Hole & Pili Min.Hole 0.15mm 0.05mm
  ʻO Min.Slot Hole 0.6mm 0.5mm
  Lākiō hiʻohiʻona

10:01

12:01

Huli Min. Ākea / hakahaka 0.05 / 0.05mm 0.025 / 0.025mm
Ke ahonui Kumumea W / S. ± 0.03mm ± 0.02mm
    (W / S≥0.3mm: ± 10%) (W / S≥0.2mm: ± 10%)
  Hole i ka lua ± 0.075mm ± 0.05mm
  Ana Hole ± 0.075mm ± 0.05mm
  Impedance 0 ≤ Waiwai ≤ 50 ±: ± 5Ω 50Ω ≤ Waiwai: ± 10% Ω  
Mea Pono Hōʻike Basefilm PI: 3mil 2mil 1mil 0.8mil 0.5mil  
    ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Basefilm Mea hoʻolako kumu ʻO Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Hōʻike Coverlay PI: 2mil 1mil 0.5mil  
  Waihona LPI ʻŌmaʻomaʻo / melemele / keʻokeʻo / ʻeleʻele / polū / ʻulaʻula  
  ʻO PI Stiffener T: 25um ~ 250um  
  FR4 Stiffener T: 100um ~ 2000um  
  ʻO SUS Stiffener T: 100um ~ 400um  
  ʻO AL Stiffener T: 100um ~ 1600um  
  Lola 3M / Tesa / Nitto  
  Pale kaua EMI Ke kiʻi ʻoniʻoni kālā / keleawe / Inika kālā  
Pau o ka ʻili OSP 0.1 - 0.3um  
  HASL Sn: 5um - 40um  
  HASL (Leed manuahi) Sn: 5um - 40um  
  ENEPIG Ni: 1.0 - 6.0um  
    Ba: 0.015-0.10um  
    Au: 0.015 - 0.10um  
  Pākuʻi gula paʻa Ni: 1.0 - 6.0um  
    Au: 0.02um - 1um  
  Gula kukuna Ni: 1.0 - 6.0um  
    Au: 0.02um - 0.1um  
  ʻO ENIG Ni: 1.0 - 6.0um  
    Au: 0.015um - 0.10um  
  Kālā Immesion Ag: 0.1 - 0.3um  
  Tin Pāpaʻi Sn: 5um - 35um  
SMT ʻAno Nā mea hoʻohui pitch 0.3mm  
    0.4mm pitch BGA / QFP / QFN  
    0201 Component