| Nā mea | Ka hiki |
| papa papa | Aluminum Base, Copper Base, Base hao, kumu seramika i ʻaʻahu keleawe, Papa Bade Hui |
| mea waiwai | Kuloko Aluminum, keleawe kūloko, alumini i lawe ʻia, ke keleawe i laweia mai |
| lapaʻau ʻili | HASL/ENIG/OSP/ke kala |
| mooolelo papa | papa paʻi ʻaoʻao hoʻokahi / papa paʻi ʻelua ʻaoʻao |
| maxi.board Nui | 1200mm*480mm |
| min.papa Nui | 5mm*5mm |
| kaha laula/apsce | 0.1mm/0.1mm |
| wili a wili | <=0.5%(mānoanoa:1.6mm,Papa Nui:300mm*300mm) |
| mānoanoa papa | 0.5mm-5.0mm |
| ka mānoanoa keleawe | 35um/70um/105um/140um/175um/210um /245um/280um/315um/350um |
| Hoʻomanawanui degere V-CUT | ʻO ke alahele CNC:±0.1mm;punch:±0.1mm |
| Hoʻopaʻa inoa V-CUT | ±0.1mm |
| mānoanoa keleawe pā puka | 20um-35um |
| Min kakau inoa o ke kulana puka (hoʻomoana me ka ʻikepili CAD) | ±3mil(±0.076mm) |
| Min.punching hole | 1.0mm ma lalo，1.0mm(Ka mānoanoa o ka papa lalo1.0mm,1.0mm) |
| Min.punching kaha huinahalike | 1.0mm ma lalo，1.0mm*1.0mm (Ka mānoanoa o ka papa ma lalo o 1.0mm, 1.0mm*1.0mm) |
| Kakau inoa o ke kaapuni pai | ±0.076mm |
| Min.drill puka anawaena | 0.6mm |
mānoanoa o ka lapaʻau ʻili | hoʻopaʻa gula: Ni 4um-6um,Au0.1um-0.5um ENIG:Ni 5um-6um,Au:0.0254um-0.127um kalaiwa:Ag3um-8um HASL:40um-100um |
| V-CUTdegree hoʻomanawanui | ± 5(Degere) |
| Papa V-CUT mānoanoa | 0.6mm-4.0mm |
| Min.Lefend laula | 0.15mm |
| Min.Solder mask wehe | 0.35mm |