| Papahana | ʻIke | Kāpena |
| 1 | papa papa | Aluminum Base, Copper Base, Ceramics base keleawe, Combined Bade Board |
| 2 | mea waiwai | Aluminum hale, keleawe hale, alumini laweia, keleawe i laweia mai |
| 3 | lapaʻau ʻili | HASL/ENIG/OSP/sikering |
| 4 | mooolelo papa | papa pnnted ʻaoʻao hoʻokahi / papa paʻi ʻelua ʻaoʻao |
| 5 | maxi.Papa Nui | 1200mm*480m(n |
| 6 | min.Papa Nui | 5mm*5mm |
| 7 | laula laina/apsce | 0.1mnV0.1mm |
| 8 | wili a wili | <=0.5%(ʻoi loa:1 .Omm, Nui o ka Papa:300mm*300mm) |
| 9 | mānoanoa papa | 0.5mm-5.0mm |
| 10 | mānoanoa copper foil | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
| 11 | hoʻomanawanui | ʻAla CNC: ±0.1 mm; kuʻi: 士 0.1 mm |
| 12 | Hoʻopaʻa inoa V-CUT | ± 0.1mm |
| 13 | mānoanoa keleawe pā puka | 20um-35um |
| 14 | Mm hoʻopaʻa inoa o ke kūlana hole (hoʻomoana me ka ʻikepili CAD) | ± 3mil(10.076mm) |
| 15 | Min.punching hole | 1.0mm(Ka mānoanoa o ka papa bebw1.0mmr1.0mm) |
| 16 | Min.punching square slot | (Ka mānoanoa o ka papa ma lalo o 1 .Omm, 1.0mm* 1.Omm) |
| 17 | Kakau inoa o ke kaapuni pai | ± 0.076mm |
| 18 | Min.drill puka anawaena | 0.6mm |
| 19 | mānoanoa o ka lapaʻau ʻili | hoʻopili gula: Ni 4um-6um>Au0.1um-0.5umENIG:Ni 5um-6um,Au:0.0254um-0.127umkalaiwa:Ag3um-8umHASL:40um-1 OOum |
| 20 | V-CUTdegree hoʻomanawanui | (Degree) |
| 21 | V-CUT mānoanoa papa | 0.6mm-4.0mm |
| 22 | Min.legend laula | 0.15mm |
| 23 | Min.Soldor mask wehe | 0.35mm |