ʻO ka mea hana PCB hoʻokūkū

Papahana ʻIke maʻiʻo ʻO Capabibty

1

hoʻonohonoho papa Kālā Aluminika, Kālā Copper BaseXrom Base, kumu keramika keleawe-CFed, Hui Bade Hui

2

mea ʻO Demostic Aluminium. Keleawe keleawe, aluminika i lawe ʻia mai, keleawe i lawe ʻia mai

3

 ʻili lāʻau HASL / ENIG / OSP / sikering

4

 waihona moʻokāki papa pnnted ʻaoʻao hoʻokahi / ʻaoʻao pālua i paʻi ʻia

5

maxi. Ka nui o ka papa 1200mm * 480m (n

6

min. Ka nui o ka papa 5mm * 5mm

7

laula / apsce laina 0.1mnV0.1mm

8

maʻawe a me ka wili <= 0.5% (tfiickness: 1 .Omm, Papa Nui: 300mm * 300mm)

9

mānoanoa papa 0.5mm-5.0mm

10

mānoanoa lapuwale keleawe 35urrV70um / 105um / 140um / 175unV210um / 245um / 280um / 315um / 35Qjm

11

ahonui ʻO ke alalai ʻana o CNC: ± 0.1 mm; kī; 士 0,1 mm

12

Ke kākau inoa ʻana ʻo V-CUT ± 0.1mm

13

Ka mānoanoa o ka paia kele 20um-35um

14

Kuhi inoa Mm o ke kūlana puka (campare me ka ʻikepili CAD) ± 3mil (10.076mm)

15

Min.punching hole 1.0mm (Ka mānoanoa o ka papa bebw1.0mmr 1.0mm)

16

ʻO Min.punching square slot (Ka mānoanoa o ka papa ma lalo o 1 .Omm, 1.0mm * 1 .Omm)

17

Ka hoʻopaʻa inoa ʻana o ka huakaʻi kaapuni ± 0.076mm

18

Min.drill puka anawaena 0.6mm

19

mānoanoa o ka lapaʻau ʻana o luna plating gula: Ni 4um-6um> Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umkālā: Ag3um-8um

HASL: 40um-1 OOum

20

ʻO ke ahonui ʻo V-CUTdegree (Kēkelē)

21

Ka mānoanoa o ka papa V-CUT 0.6mm-4.0mm

22

Min. Hāʻawi i ka laulā 0.15mm

23

ʻO ka weheʻana o ka mask Mas 0.35mm