Mea Hana PCB hoʻokūkū

wikiwiki multilayer High Tg Papa me ke gula immersion no ka modem

ʻO ka wehewehe pōkole:

ʻAno mea: FR4 Tg170

Helu papa: 4

Min laula me ka hakahaka: 6 mil

Ka nui o ka lua min: 0.30mm

ʻO ka mānoanoa o ka papa i pau: 2.0mm

ʻO ka mānoanoa keleawe i pau: 35um

Hoʻopau: ENIG

Ka waihoʻoluʻu pale pale: ʻōmaʻomaʻo"

Ka manawa alakaʻi: 12 lā


Huahana Huahana

Huahana Huahana

ʻAno mea: FR4 Tg170

Helu papa: 4

Min laula me ka hakahaka: 6 mil

Ka nui o ka lua min: 0.30mm

ʻO ka mānoanoa o ka papa i pau: 2.0mm

ʻO ka mānoanoa keleawe i pau: 35um

Hoʻopau: ENIG

Ka waihoʻoluʻu huna huna: ʻōmaʻomaʻo``

Ka manawa alakaʻi: 12 lā

High Tg board

Ke piʻi ka mahana o ka papa kaapuni Tg kiʻekiʻe i kekahi ʻāpana, e hoʻololi ka substrate mai ka "mokuʻāina aniani" a i "ke aupuni Ruber", a kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg) o ka pā.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (℃) kahi e paʻa ai ka substrate.ʻO ia hoʻi, ʻo nā mea substrate PCB maʻamau i ka wela kiʻekiʻe ʻaʻole wale e hoʻoulu i ka palupalu, deformation, hoʻoheheʻe a me nā mea ʻē aʻe, akā hōʻike pū kekahi i ka emi ʻana o nā waiwai mechanical a me nā uila. ).

ʻOi aku ka nui o nā papa Tg maʻamau ma mua o 130 degere, ʻoi aku ka nui o Tg kiʻekiʻe ma mua o 170 degere, a ʻoi aku ka Tg waena ma kahi o 150 degere.

ʻO ka maʻamau, kapa ʻia ka PCB me Tg≥170 ℃ kiʻekiʻe Tg kaapuni papa.

Hoʻonui ka Tg o ka substrate, a e hoʻomaikaʻi a hoʻomaikaʻi ʻia ke kūpaʻa wela, ka pale ʻana i ka moisture, ka pale kemika, ke kūpaʻa kūpaʻa a me nā ʻano ʻē aʻe o ka papa kaapuni.ʻOi aku ka kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka hana pale wela o ka pā.ʻOi aku ma ke kaʻina alakaʻi ʻole, hoʻohana pinepine ʻia ka TG kiʻekiʻe.

ʻO ka Tg kiʻekiʻe e pili ana i ka pale wela kiʻekiʻe.Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, i ka hoʻomohala ʻana i ka hana kiʻekiʻe, multilayer kiʻekiʻe, ka pono o ka PCB substrate material kiʻekiʻe ka wela e like me ka hōʻoia nui.ʻO ka puka ʻana a me ka hoʻomohala ʻana o ka ʻenehana hoʻonohonoho kiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT e hilinaʻi nui ʻia ka PCB i ke kākoʻo o ke kūpaʻa wela kiʻekiʻe o ka substrate ma ke ʻano o ka aperture liʻiliʻi, nā wili maikaʻi a me nā ʻano lahilahi.

No laila, ʻo ka ʻokoʻa ma waena o ka FR-4 maʻamau a me ka kiʻekiʻe-TG FR-4 ʻo ia i ka mokuʻāina wela, ʻoi aku ma hope o ka hygroscopic a me ka wela, ka ikaika mechanical, dimensional stability, adhesion, absorption wai, thermal decomposition, thermal expansion a me nā kūlana ʻē aʻe o ʻokoʻa nā mea.ʻOi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate PCB maʻamau.I nā makahiki i hala iho nei, ua hoʻonui ʻia ka nui o nā mea kūʻai aku e koi ana i ka papa kaapuni Tg kiʻekiʻe i kēlā me kēia makahiki.


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