ʻO ka mea hana PCB hoʻokūkū

wikiwiki multilayer Papa kiʻekiʻe Tg me ke gula immersion no ka modem

Hōʻike Pōkole:

Nāʻano pono: FR4 Tg170

Helu papa: 4

Min laulā ākea / hakahaka: 6 mil

Ka nui o ka lua: 0.30mm

Pau ka mānoanoa o ka papa: 2.0mm

Pau ka mānoanoa keleawe: 35um

Pau: ENIG

ʻO ke kala mask mask: ʻōmaʻomaʻo

Ka manawa alakaʻi: 12 mau lā


ʻIke kikoʻī

Nā huahana huahana

Nāʻano pono: FR4 Tg170

Helu papa: 4

Min laulā ākea / hakahaka: 6 mil

Ka nui o ka lua: 0.30mm

Pau ka mānoanoa o ka papa: 2.0mm

Pau ka mānoanoa keleawe: 35um

Pau: ENIG

ʻO ke kala mask mask: ʻōmaʻomaʻo "

Ka manawa alakaʻi: 12 mau lā

High Tg board

Ke piʻi aʻe ka mahana o ka papa Tg circuit kiʻekiʻe i kekahi wahi, e loli ka substrate mai ka "aniani mokuʻāina" a i ka "state rubber", a kapa ʻia ka mahana i kēia manawa ke aniani hoʻololi wela (Tg) o ka pā. I nā huaʻōlelo ʻē aʻe, ʻo Tg ke ana wela kiʻekiʻe (℃) kahi e paʻa ai ka substrate. ʻO ia e ʻōlelo, nā mea substrate PCB maʻamau i ka mahana wela ʻaʻole hana wale i ka palupalu, deformation, hoʻoheheʻe a me nā hanana ʻē aʻe, akā hōʻike pū kekahi i ka emi nui o ka mechanical a me nā pono uila (manaʻo wau ʻaʻole ʻoe makemake e ʻike i kā lākou huahana e hōʻike i kēia hihia. ).

ʻOi aku nā papa 130 Tg ma luna o 130 kekelē, ʻoi aku ka nui o Tg ma mua o nā kekelē 170, a ʻo ka medium Tg ma kahi o 150 kekelē.

ʻO ka maʻamau, kapa ʻia ka PCB me Tg≥170 ℃ kiʻekiʻe kaapuni ʻo Tg.

Hoʻonui ka Tg o ka substrate, a e hoʻomaikaʻi a hoʻomaikaʻi ʻia ke kūpaʻa wela, kūpale kūpale, kūpaʻa kemika, kūpaʻa kūpaʻa a me nā ʻano ʻē aʻe o ka papa kaapuni. ʻO ke kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka hana kūpaʻa wela o ka pā. ʻOi loa i ke kaʻina alakaʻi-ʻole, hoʻopili pinepine ʻia ʻo TG kiʻekiʻe.

ʻO ke kiʻekiʻe Tg pili i ke kūpaʻa wela kiʻekiʻe. Me ka ulu wikiwiki ʻana o ka ʻoihana uila, ʻo ia hoʻi nā huahana uila i hōʻike ʻia e nā kamepiula, i ka hoʻomohala ʻana i ka hana kiʻekiʻe, multilayer kiʻekiʻe, ka pono no ka mea substrate PCB ʻoi aku ke kiʻekiʻe o ke kūpaʻa wela ma ke ʻano he hōʻoia nui. ʻO ke kū ʻana a me ka hoʻomohala ʻana o ka ʻenehana hoʻonoho kiʻekiʻe kiʻekiʻe i kūlike ʻia e SMT a me CMT e hoʻonui i ka PCB i ke kākoʻo o ke kūpaʻa wela kiʻekiʻe o ka substrate e pili ana i ka puka liʻiliʻi, nā uea maikaʻi a me ka lahilahi.

No laila, ʻo ka ʻokoʻa ma waena o FR-4 maʻamau a kiʻekiʻe-TG FR-4 ʻo ia ma ka mokuʻāina wela, keu hoʻi ma hope o ka hygroscopic a me ka wela, ka ikaika mechanical, paʻa paʻa, adhesion, lawe wai, hoʻohauna wela, hoʻonui hoʻomehana a me nā kūlana ʻē aʻe o ʻokoʻa nā mea. ʻOi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea hana substrate PCB. I nā makahiki i hala iho nei, ua hoʻonui ʻia ka helu o nā mea kūʻai aku e koi ana i ka papa kaʻa kaʻa ʻo Tg kiʻekiʻe i kēlā me kēia makahiki.


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