Mea Hana PCB hoʻokūkū

ʻO ka pāpaʻi seramika e pili ana i ka foil keleawe ma ka wela kiʻekiʻe i hoʻopaʻa pono ʻia me ka alumini ʻokikene (Al2O3) a i ʻole ka alumini nitride (AlN) ka ʻili o ka pā seramika (hoʻokahi a i ʻole pālua) ka papa hana kūikawā. ʻO ka substrate composite ultra-thin he hana insulation uila maikaʻi loa, ka conductivity thermal kiʻekiʻe, ka waiwai brazing palupalu maikaʻi a me ka ikaika adhesion kiʻekiʻe, a hiki ke kālai i nā ʻano kiʻi like ʻole e like me ka papa PCB, me ka mana nui o kēia manawa. No laila, ua lilo ka ceramic substrate i mea kumu o ka ʻenehana ʻenehana uila uila a me ka ʻenehana interconnection.

ʻO ka pōmaikaʻi o ka papa ceramic:

ʻO ke koʻikoʻi mechanical ikaika, kūlana paʻa; Ka ikaika kiʻekiʻe, kiʻekiʻe thermal conductivity, kiʻekiʻe insulation; Pili ikaika, anti - corrosion.

◆ Hana maikaʻi i ka pōʻai wela, nā manawa pōkole a hiki i 50,000 mau manawa, hilinaʻi kiʻekiʻe.

◆ Hiki ke kālai ʻia ke ʻano o nā kiʻi like ʻole e like me PCB (a i ʻole IMS substrate); ʻAʻohe haumia, ʻaʻohe pollution.

◆ ʻO ka mahana lawelawe -55 ℃ ~ 850 ℃; ʻO ke koena hoʻonui wela e kokoke ana i ke silika, e hoʻomaʻamaʻa i ke kaʻina hana o ka module mana.

ʻO ka hoʻohana ʻana i ka papa hana seramika:

ʻO nā substrates seramika (alumina, alumini nitride, silicon nitride, zirconia a me ka zirconia toughening alumina ʻo ZTA) ma muli o kāna mau mea wela maikaʻi, mechanical, chemical, a me dielectric waiwai, ua hoʻohana nui ʻia i loko o ka puʻupuʻu semiconductor chip, sensors, communication electronics, mobile phones. ʻO nā pahu naʻauao ʻē aʻe, nā mea kani a me nā mika, ka ikehu hou, ke kumu kukui hou, ke kaʻa kaʻa kiʻekiʻe kiʻekiʻe, ka makani makani, robotics, aerospace a me ka pale. pūʻali koa a me nā kahua ʻenehana kiʻekiʻe ʻē aʻe . Wahi a nā helu helu, i kēlā me kēia makahiki ua hiki i nā ʻumi piliona o ka mākeke, ʻoi aku hoʻi i nā makahiki i hala iho nei, me ka ulu wikiwiki ʻana o Kina i nā kaʻa ikehu hou, ke kaʻa kiʻekiʻe kiʻekiʻe a me 5 g base station, nui ka koi ʻana o ka substrate ceramic, ma ke kaʻa wale nō. wahi, ka nui koi i kēlā me kēia makahiki a hiki i 5 miliona PCS; ʻAʻole hoʻohana nui ʻia ka substrate seramika alumina i ka ʻoihana uila a me ka uila, akā pū kekahi i ka sensor kaomi a me ke kahua dissipation wela o LED.

Hoʻohana ʻia ma nā wahi 5 e hahai nei:

1.IGBT module no ke kaʻaahi kiʻekiʻe, nā kaʻa ikehu hou, ka mana makani, nā robots a me nā kahua kahua 5G;

2.Smart phone backplane a me ka ʻike manamana lima;

3.New hanauna paʻa wahie keena;

4. ʻO ka mīkini paʻi paʻa pāpaʻi hou a me ka ʻike oxygen;

5.LD/LED ka wela wela, laser system, hybrid integrated circuit;