ʻAno mea: FR4 Tg170
Helu papa: 4
Min laula me ka hakahaka: 6 mil
Ka nui o ka lua min: 0.30mm
ʻO ka mānoanoa o ka papa i pau: 2.0mm
Pau ka mānoanoa keleawe: 35um
Hoʻopau: ENIG
Ka waihoʻoluʻu huna huna: ʻōmaʻomaʻo``
Ka manawa alakaʻi: 12 lā
Ke piʻi ka mahana o ka papa kaapuni Tg kiʻekiʻe i kekahi ʻāpana, e hoʻololi ka substrate mai ka "mokuʻāina aniani" a i "ke aupuni Ruber", a kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg) o ka pā. ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (℃) kahi e paʻa ai ka substrate. ʻO ia hoʻi, ʻo nā mea substrate PCB maʻamau i ka wela kiʻekiʻe ʻaʻole wale e hana i ka palupalu, deformation, hoʻoheheʻe a me nā mea ʻē aʻe, akā hōʻike pū kekahi i ka emi ʻana o nā waiwai mechanical a me nā uila (ʻaʻole wau makemake e ʻike i kā lākou huahana i kēia hihia. ).
ʻOi aku ka nui o nā papa Tg maʻamau ma mua o 130 degere, ʻoi aku ka nui o Tg kiʻekiʻe ma mua o 170 degere, a ʻoi aku ka Tg waena ma kahi o 150 degere.
ʻO ka maʻamau, kapa ʻia ka PCB me Tg≥170 ℃ kiʻekiʻe Tg kaapuni papa.
Hoʻonui ka Tg o ka substrate, a e hoʻomaikaʻi ʻia a hoʻomaikaʻi ʻia ka pale ʻana o ka wela, ka pale ʻana i ka wai, ka pale kemika, ke kūpaʻa kūpaʻa a me nā ʻano ʻē aʻe o ka papa kaapuni. ʻOi aku ka kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka hana pale wela o ka pā. ʻOi aku ma ke kaʻina alakaʻi ʻole, hoʻohana pinepine ʻia ka TG kiʻekiʻe.
ʻO ka Tg kiʻekiʻe e pili ana i ka pale wela kiʻekiʻe. Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, i ka hoʻomohala ʻana i ka hana kiʻekiʻe, multilayer kiʻekiʻe, ka pono o ka PCB substrate material kiʻekiʻe ka wela e like me ka hōʻoia nui. ʻO ka puka ʻana a me ka hoʻomohala ʻana o ka ʻenehana hoʻonohonoho kiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT e hilinaʻi nui ʻia ka PCB i ke kākoʻo o ke kūpaʻa wela kiʻekiʻe o ka substrate ma ke ʻano o ka puka liʻiliʻi, nā wili maikaʻi a me nā ʻano lahilahi.
No laila, ʻo ka ʻokoʻa ma waena o ka FR-4 maʻamau a me ka kiʻekiʻe-TG FR-4 ʻo ia i ka mokuʻāina wela, ʻoi aku ma hope o ka hygroscopic a me ka wela, ka ikaika mechanical, dimensional stability, adhesion, wai absorption, thermal decomposition, thermal expansion a me nā kūlana ʻē aʻe. ʻokoʻa nā mea. ʻOi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate PCB maʻamau. I nā makahiki i hala iho nei, ua hoʻonui ʻia ka nui o nā mea kūʻai aku e koi ana i ka papa kaapuni Tg kiʻekiʻe i kēlā me kēia makahiki.
E noʻonoʻo i ka hāʻawi ʻana i nā hoʻonā mong pu no 5 mau makahiki.