Hoʻolaha ma ka mālama ʻana i ka ʻenehana “Compreent Failure Analysis Technology and Practice Case” palapala noi noi Seminar Senior

 

ʻO ka ʻelima Institute of Electronics, Ministry of Industrial and Technology Technology

Nā ʻoihana a me nā ʻoihana:

I mea e kōkua ai i nā ʻenekini a me nā ʻenehana e hoʻokau i nā pilikia ʻenehana a me nā hopena o ka hōʻuluʻulu ʻana o ka ʻāpana a me PCB & PCBA hōʻiliʻili ʻole i ka manawa pōkole loa. Kōkua i nā limahana kūpono i ka ʻoihana e hoʻomaopopo ʻōnaehana a hoʻomaikaʻi i ka pae loea e pili ana e hōʻoia i ka pono a me ka hilinaʻi o nā hopena hōʻike. ʻO ka Fifth Institute of Electronics o ke Kuhina ʻoihana ʻenehana a me nā ʻenehana ʻikepili (MIIT) i mālama ʻia i ka manawa like ma ka pūnaewele a me ka pūnaewele ma Nowemapa 2020.

1. Ka lōkō pūnaewele a me ka hoʻopili ʻana o "Component Failure Analysis Technology a me nā hihia kūpono" Nānā loiloi palapala noi.

2. Mālama i nā ʻenehana uila PCB & PCBA hilinaʻi pono ʻole kālailai hana loiloi hihia hihia o ka pūnaewele a me ka hoʻopili pūnaewele.

3. Hoʻohui pūnaewele a me waho pūnaewele o ka hoʻokolohua hilinaʻi kūlohelohe a me ka hōʻoia hōʻoia pono a me ka hōʻiliʻili hohonu o ka maikaʻi ʻole o ka huahana uila.

4. Hiki iā mākou ke hoʻolālā i nā papa a hoʻonohonoho i ka hoʻomaʻamaʻa kūloko no nā ʻoihana.

 

Nā ʻike aʻo:

1. Hoʻolauna i ka hōʻiliʻili ʻole ʻana;

2. Ka ʻenehana kālailai holomua o nā pono uila;

2.1 Nā kaʻina hana maʻamau no ka hōʻiliʻili ʻole ʻana

2.2 Alanui maʻamau o ka hōʻiliʻili ʻole luku

2.3 Ke ala maʻamau o ka hoʻopili semi-luku

2.4 Ke ala maʻamau o ka hōʻiliʻili luku

2.5 Ke kaʻina holoʻokoʻa o ka hōʻiliʻili hihia hihia ʻana

E hoʻopili ʻia ka ʻenehana physic 2.6 ʻole i nā huahana mai FA a PPA a me CA

3. Nā pono hana kālailai pono ʻole ʻana;

4. ʻO nā ʻano hana ʻole nui a me nā ʻano hana kūlohelohe ʻole o nā ʻenehana uila;

5. Ka nānā pono ʻole ʻana o nā mea uila uila, nā hihia maʻamau o nā hemahema o nā mea (nā ʻāpana chip, nā kīnā o ke aniani, nā hemahema o ka papa chip passivation, nā kīnā pili, nā hemahema o ke kaʻina hana, nā ʻāpana pili pili chip, nā lako RF i lawe ʻia mai - nā ʻino kūnewa wela, nā hemahema kūikawā, nā ʻano kūlohelohe, nā hemahema o loko, nā hemahema o nā mea; Kūʻē, capacitance, inductance, diode, triode, MOS, IC, SCR, kaapuni, a pēlā aku.

6. Ka hoʻohana ʻana i ka ʻenehana physics holomua i ka hoʻolālā huahana

6.1 Nā hihia kūleʻa i hoʻokumu ʻia e ka hoʻolālā kaapuni kūpono ʻole

6.2 Nā hihia kūleʻa i hoʻokumu ʻia e ka pale transmission wā lōʻihi kūpono ʻole

6.3 Nā hihia kūleʻa i hana ʻia e ka hoʻohana kūpono ʻole o nā ʻāpana

6.4 Nā hihia kūleʻa i hoʻokumu ʻia e nā hemahema hoʻokaulike o ka hale hui a me nā pono

6.5 Nā hihia kūleʻa o ke kaiapuni adaptability a me nā hemahema o ka hoʻolālā ʻana i ka ʻaoʻao mikionali

6.6 Nā hihia kūleʻa i hoʻokumu ʻia e ke kaulike kūpono ʻole

6.7 Nā hihia kūleʻa i hoʻokumu ʻia e ka hoʻolālā hoʻomanawanui kūpono ʻole

6.8 Naehana hoʻoili a me ka nāwaliwali maoli o ka pale ʻana

6.9 Hewa i hoʻokumu ʻia e ka mahele o ka ʻāpana kikowaena

Nā hihia 6.10 FAILURE i hoʻokumu ʻia e nā hemahema hoʻolālā PCB

6.11 ʻO nā hihia kūleʻa i hoʻokumu ʻia e nā hemahema hoʻolālā hiki ke hana


Ka manawa Post: Dec-03-2020