Mea Hana PCB hoʻokūkū

Hoʻolaha no ka mālama ʻana i ka "Component Failure Analysis Technology and Practice Case" noiʻi noiʻi Seminar Senior

ʻO ka ʻelima Institute of Electronics, Ministry of Industry and Information Technology

Nā ʻoihana a me nā hui:

I mea e kōkua ai i nā ʻenekinia a me nā ʻenehana e hoʻopaʻa i nā pilikia ʻenehana a me nā hoʻonā o ka nānā ʻana i ka hemahema o ka ʻāpana a me ka nānā ʻole ʻana o ka PCB&PCBA i ka manawa pōkole;E kōkua i nā limahana kūpono i ka ʻoihana e hoʻomaopopo pono a hoʻomaikaʻi i ka pae ʻenehana kūpono e hōʻoia i ka pono a me ka hilinaʻi o nā hopena hōʻike.Ua mālama ʻia ka Fifth Institute of Electronics of the Ministry of Industry and Information Technology (MIIT) i ka manawa like ma ka pūnaewele a me ka offline ma Nowemapa 2020:

1. Online a me waho synchronization o "Component Failure Analysis Technology and Practical Cases" Application analysis Senior workshop.

2. Hoʻopaʻa i nā ʻāpana uila PCB&PCBA hilinaʻi hiki ʻole ke hoʻomaʻamaʻa i ka ʻenehana hana hoʻomaʻamaʻa hihia no ka hoʻonohonoho pūnaewele a me waho.

3. Ma ka pūnaewele a me ka hoʻopaʻa ʻole ʻana o ka hoʻokolohua hilinaʻi kaiapuni a me ka hōʻoia ʻike kikoʻī hilinaʻi a me ka loiloi hohonu o ka hāʻule ʻana o ka huahana uila.

4. Hiki iā mākou ke hoʻolālā i nā papa a hoʻonohonoho i ka hoʻomaʻamaʻa kūloko no nā ʻoihana.

Nā mea aʻo:

1. Hoʻomaka i ka nānā ʻana i ka hemahema;

2. Ka ʻenehana kālailai hāʻule ʻana o nā ʻāpana uila;

2.1 Nā kaʻina hana kumu no ka nānā ʻana i ka hāʻule

2.2 Alanui kumu o ka hoʻomāinoino ʻole

2.3 Ke ala kumu o ka nānā ʻana semi-destructive

2.4 Alanui kumu o ka hoʻomāinoino ana

2.5 ʻO ke kaʻina holoʻokoʻa o ka hōʻiliʻili ʻana i ka hihia

2.6 E hoʻohana ʻia ka ʻenehana physics hāʻule i nā huahana mai FA a i PPA a me CA

3. ʻO nā lako a me nā hana hoʻonaʻauao hemahema maʻamau;

4. Nā ʻano hemahema nui a me nā ʻano hana hemahema o nā ʻāpana uila;

5. Ka nānā 'ole 'ana i nā mea uila nui, nā hihia ma'amau o nā hemahema waiwai (nā kīpē, nā pō'ino aniani, nā hemahema papa passivation chip, nā hemahema ho'opa'a, nā hemahema ka'ina hana, nā hemahema ho'opa'a pu'upu'u, nā mea RF i lawe 'ia mai - nā hemahema o ka thermal structure, nā hemahema kūikawā, ka hale ma'amau, nā hemahema o loko, nā hemahema waiwai; Ke kū'ē, capacitance, inductance, diode, triode, MOS, IC, SCR, module circuit, etc.)

6. Ka hoʻohana ʻana i ka ʻenehana physics hāʻule i ka hoʻolālā huahana

6.1 Nā hihia hāʻule ma muli o ka hoʻolālā kaapuni kūpono ʻole

6.2 Nā hihia hāʻule i hoʻokumu ʻia e ka pale hoʻouna lōʻihi kūpono ʻole

6.3 Nā hihia hāʻule ma muli o ka hoʻohana pono ʻole ʻana i nā ʻāpana

6.4 Nā hihia hāʻule ma muli o nā hemahema kūpono o ka hale hui a me nā mea waiwai

6.5 Nā hihia hāʻule o ka hoʻololi ʻana i ke kaiapuni a me nā hemahema o ka hoʻolālā ʻana o ka misionari

6.6 Nā hihia hāʻule ma muli o ka hoʻohālikelike kūpono ʻole

6.7 Nā hihia hāʻule ma muli o ka hoʻolālā hoʻomanawanui kūpono ʻole

6.8 Mekani maoli a me nawaliwali o ka pale

6.9 Ma muli o ka hāʻawi ʻana i nā ʻāpana ʻāpana

6.10 HOLOHOLO nā hihia ma muli o nā hemahema hoʻolālā PCB

6.11 Hiki ke hana ʻia nā hihia hemahema i hana ʻia e nā hemahema