Mea Hana PCB hoʻokūkū

Hoʻolaha e pili ana i ka mālama ʻana i ka "Component Failure Analysis Technology and Practice Case" Application analysis Senior Seminar

ʻO ka ʻelima Institute of Electronics, Ministry of Industry and Information Technology

Nā ʻoihana a me nā hui:

I mea e kōkua ai i nā ʻenekinia a me nā ʻenehana e hoʻopaʻa i nā pilikia ʻenehana a me nā hoʻonā o ka nānā ʻana i ka hemahema o ka ʻāpana a me ka nānā ʻole ʻana o ka PCB&PCBA i ka manawa pōkole; E kōkua i nā limahana kūpono i ka ʻoihana e hoʻomaopopo pono a hoʻomaikaʻi i ka pae ʻenehana kūpono e hōʻoia i ka pono a me ka hilinaʻi o nā hopena hōʻike. Ua mālama ʻia ka Fifth Institute of Electronics of the Ministry of Industry and Information Technology (MIIT) i ka manawa like ma ka pūnaewele a me ka offline ma Nowemapa 2020:

1. Ma ka pūnaewele a me ka hoʻopaʻa ʻole ʻana o ka "Component Failure Analysis Technology and Practical Cases" Application analysis Senior workshop.

2. Hoʻopaʻa i nā ʻāpana uila PCB&PCBA hilinaʻi ʻole ka nānā ʻana i ka ʻenehana hana hoʻomaʻamaʻa hihia no ka hoʻonohonoho pūnaewele a me waho.

3. Ma ka pūnaewele a me ka hoʻopaʻa ʻole ʻana o ka hoʻokolohua hilinaʻi kaiapuni a me ka hōʻoia hōʻoia hilinaʻi a me ka nānā hohonu ʻana o ka hemahema o ka huahana uila.

4. Hiki iā mākou ke hoʻolālā i nā papa a hoʻonohonoho i ka hoʻomaʻamaʻa kūloko no nā ʻoihana.

Nā mea aʻo:

1. Hoʻomaka i ka nānā ʻana i ka hemahema;

2. Ka 'ike loea no ka ho'opili 'ana i nā mea uila;

2.1 Nā kaʻina hana kumu no ka nānā ʻana i ka hāʻule

2.2 Alanui kumu o ka hoʻomāinoino ʻole

2.3 Ke ala kumu o ka nānā ʻana semi-destructive

2.4 Alanui kumu o ka hoʻomāinoino ana

2.5 ʻO ke kaʻina holoʻokoʻa o ka hōʻiliʻili ʻana i ka hihia

2.6 E hoʻohana ʻia ka ʻenehana physics hāʻule i nā huahana mai FA a i PPA a me CA

3. ʻO nā lako a me nā hana hoʻonaʻauao hemahema maʻamau;

4. ʻO nā ʻano hana hāʻule nui a me nā ʻano hana hemahema o nā ʻāpana uila;

5. Ka hoʻopololei ʻana i nā ʻāpana uila nui, nā hihia maʻamau o nā mea ʻino (nā kīpē, nā pōʻino aniani, nā hemahema papa passivation chip, nā hemahema hoʻopaʻa ʻana, nā hemahema kaʻina hana, nā hemahema hoʻopaʻa chip, nā mea RF i lawe ʻia mai - nā hemahema o ka thermal structure, nā hemahema kūikawā, nā ʻano kūlohelohe, nā hemahema o ka hale o loko, nā hemahema o ke kino, ka capacitance, inductance, diode, triode, MOS, IC, SCR, module circuit, etc.)

6. Ka hoʻohana ʻana i ka ʻenehana physics hāʻule i ka hoʻolālā huahana

6.1 Nā hihia hāʻule ma muli o ka hoʻolālā kaapuni kūpono ʻole

6.2 Nā hihia hāʻule ma muli o ka pale ʻana i ka hoʻouna lōʻihi ʻole

6.3 Nā hihia hāʻule ma muli o ka hoʻohana pono ʻole ʻana i nā ʻāpana

6.4 Nā hihia hāʻule ma muli o nā hemahema kūpono o ka hale hui a me nā mea waiwai

6.5 Nā hihia hiki ʻole o ka hoʻololi ʻana i ke kaiapuni a me nā hemahema o ka hoʻolālā ʻana i ka misionari

6.6 Nā hihia hāʻule ma muli o ka hoʻohālikelike kūpono ʻole

6.7 Nā hihia hāʻule ma muli o ka hoʻolālā hoʻomanawanui kūpono ʻole

6.8 ʻO ka ʻenehana kūlohelohe a me ka nāwaliwali kūlohelohe o ka pale

6.9 Ma muli o ka hāʻawi ʻana i nā ʻāpana ʻāpana

6.10 HOLOHOLO nā hihia ma muli o nā hemahema hoʻolālā PCB

6.11 Hiki ke hana ʻia nā hihia hemahema ma muli o nā hemahema hoʻolālā