| Hoʻokaʻawale | mau mea | Hiki maʻamau | Hiki kūikawā |
| helu papa | ʻO ka PCB paʻakiki | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| papa | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min. mānoanoa | |||
| Max. mānoanoa | 6mm | 8mm | |
| Max. Nui | 485mm * 1000mm | 485mm * 1500mm | |
| Hole & Slot | Min.Hole | 0.15mm | 0.05mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| ʻAspect Ratio | 10:01 | 12:01 | |
| Kaohi | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Hoʻomanawanui | Kakau W / S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Puka i ka lua | ± 0.075mm | ± 0.05mm | |
| Ana Puka | ± 0.075mm | ± 0.05mm | |
| Ka hoʻopalekana | 0 ≤ Waiwai ≤ 50Ω : ± 5Ω 50Ω ≤ Waiwai : ± 10%Ω | ||
| Mea waiwai | Palapala Kiʻiʻoniʻoni | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Mea hoʻolako nui Basefilm | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Hōʻike Coverlay | PI : 2mil 1mil 0.5mil | ||
| LPI kala | ʻOmaomao / Melemele / Keʻokeʻo / ʻEleʻele / Polū / ʻulaʻula | ||
| PI ʻoʻoleʻa | T : 25um ～250um | ||
| FR4 mea hoʻopaʻakikī | T : 100um ～2000um | ||
| SUS mea hoʻopaʻa | T : 100um ～400um | ||
| AL Stiffener | T : 100um ～1600um | ||
| Lepe | 3M / Tesa / Nitto | ||
| EMI pale | Kiʻiʻoniʻoni kala / keleawe / ʻīnika kala | ||
| Hoʻopau ʻili | OSP | 0.1 - 0.3um | |
| HASL | Sn : 5um - 40um | ||
| HASL(Leed manuahi) | Sn : 5um - 40um | ||
| ENEPIG | Ni : 1.0 - 6.0um | ||
| Ba: 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Hoʻopili i ke gula paʻakikī | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 1um | |||
| gula uila | Ni : 1.0 - 6.0um | ||
| Au : 0.02um - 0.1um | |||
| ENIG | Ni : 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| kala kala | Ag: 0.1 - 0.3um | ||
| Pa'i Pa'i | Sn : 5um - 35um | ||
| SMT | ʻAno | 0.3mm pitch Connectors | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Māhele |