| Nā mea | Ka hiki |
| Helu papa | 1-40 papa |
| ʻAno Laminates | FR-4(Kiʻekiʻe Tg, Halogen Free, Kiʻekiʻe alapinepine) |
| FR-5, CEM-3, PTFE, BT, Getek, Aluminum base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Mānoanoa papa | 0.2mm-6mm |
| Max Base kaumaha keleawe | 210um (6oz) no ka papa loko 210um (6oz) no ka papa waho |
| ʻO ka nui o ka drill mechanical min | 0.2mm (0.008") |
| Lakiō hiʻohiʻona | 12:01 |
| Nui ka nui o ka panel | ʻaoʻao ʻaoʻao a ʻelua ʻaoʻao: 500mm * 1200mm, |
| Nā ʻāpana ʻāpana he nui: 508mm X 610mm (20" X 24") |
| Min laula laina/space | 0.076mm / 0.0.076mm (0.003" / 0.003") |
| Via ʻano puka | Makapō / Kanu / Hoʻopili (VOP, VIP…) |
| HDI / Microvia | ʻAE |
| Hoʻopau ʻili | HASL |
| Ke alakai manuahi HASL |
| Gula Kaiapuni (ENIG), Kino Immersion, Kālā Immersion |
| Mea Hoʻomaʻamaʻa Solderability Organic (OSP) / ENTEK |
| Ke gula Flash |
| ENEPIG |
| Kāwili gula koho, mānoanoa gula a hiki i 3um(120u") |
| Manalima Gula, Paʻi Kalapona, S/M Hiki ke Peel |
| kala pale pale solder | ʻOmaomao, ʻulaʻula, keʻokeʻo, ʻeleʻele, akaka, etc. |
| Ka hoʻopalekana | Hoʻokahi meheu, ʻokoʻa, coplanar impedance i hoʻomalu ʻia ± 10% |
| ʻAno hoʻopau outline | ʻO ke alahele CNC; V-Scoring / ʻoki; Kuʻi |
| Hoʻomanawanui | ʻO ka hoʻomanawanui ʻana o ka Min Hole (NPTH) | ±0.05mm |
| ʻO ka hoʻomanawanui ʻana o ka lua min (PTH) | ±0.075mm |
| ʻO ka hoʻomanawanui ʻana o ke ʻano min | ±0.05mm |
