Papahana | Maʻiʻo | Kāpena |
1 | papa papa | Aluminum Base, Copper Base, Ceramics base keleawe, Combined Bade Board |
2 | mea waiwai | Aluminum hale. keleawe hale, alumini i laweia mai, keleawe i laweia mai |
3 | lapaʻau ʻili | HASL/ENIG/OSP/sikering |
4 | mooolelo papa | papa pnnted ʻaoʻao hoʻokahi / papa paʻi ʻelua ʻaoʻao |
5 | maxi.Papa Nui | 1200mm*480m(n |
6 | min.Papa Nui | 5mm*5mm |
7 | laula laina/apsce | 0.1mnV0.1mm |
8 | wili a wili | <= 0.5%(ʻoluʻolu:1 .Omm, Nui o ka Papa:300mm*300mm) |
9 | mānoanoa papa | 0.5mm-5.0mm |
10 | mānoanoa copper foil | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
11 | hoʻomanawanui | ʻO ke ala ʻana o CNC: ±0.1 mm; kuʻi: 士 0.1 mm |
12 | Hoʻopaʻa inoa V-CUT | ± 0.1mm |
13 | mānoanoa keleawe pā puka | 20um-35um |
14 | Mm kākau inoa o ka lua kūlana (hoʻomoana me ka ʻikepili CAD) | ± 3mil(10.076mm) |
15 | Min.punching hole | 1.0mm(Ka mānoanoa o ka papa bebw1.0mmr1.0mm) |
16 | Min.punching square slot | (Ka mānoanoa o ka papa ma lalo o 1 .Omm, 1.0mm* 1.Omm) |
17 | Kakau inoa o ke kaapuni pai | ± 0.076mm |
18 | Min.drill puka anawaena | 0.6mm |
19 | mānoanoa o ka lapaʻau ʻili | hoʻopili gula: Ni 4um-6um>Au0.1um-0.5umENIG:Ni 5um-6um,Au:0.0254um-0.127umkalaiwa:Ag3um-8umHASL:40um-1 OOum |
20 | V-CUTdegree hoʻomanawanui | (Degree) |
21 | V-CUT mānoanoa papa | 0.6mm-4.0mm |
22 | Min.legend laula | 0.15mm |
23 | Min.Soldor mask wehe | 0.35mm |