Mea Hana PCB hoʻokūkū

ʻO MCPCB ka pōkole o Metal core PCBs, me ka PCB e pili ana i ka aluminika, ka PCB i hoʻokumu ʻia i ke keleawe a me ka PCB i hoʻokumu ʻia i ka hao.

ʻO ka papa alumini ka mea maʻamau. Aia ka waihona kumu i kahi kumu alumini, FR4 maʻamau a me ke keleawe. Hōʻike ia i kahi papa ʻaʻahu wela e hoʻopau i ka wela ma kahi ala maikaʻi loa i ka wā e hoʻoluʻu ai i nā ʻāpana. I kēia manawa, manaʻo ʻia ʻo Aluminum Based PCB ka hopena i ka mana kiʻekiʻe. Hiki i ka papa hana alumini ke hoʻololi i ka papa seramika frangible, a hāʻawi ka alumini i ka ikaika a me ka lōʻihi i kahi huahana i hiki ʻole i nā kumu seramika.

ʻO ka substrate keleawe kekahi o nā substrate metala nui loa, a ʻoi aku ka maikaʻi o kāna conductivity thermal ma mua o nā substrate aluminika a me nā substrate hao. He kūpono ia no ka hoʻoheheʻe wela kiʻekiʻe loa o nā kaʻa kaʻa alapine kiʻekiʻe, nā ʻāpana i nā ʻāpana me nā ʻano like ʻole o ke kiʻekiʻe a me ka haʻahaʻa haʻahaʻa a me nā lako kamaʻilio pololei.

ʻO ka papa insulation thermal kekahi o nā ʻāpana koʻikoʻi o ka substrate keleawe, no laila ʻo ka mānoanoa o ke keleawe keleawe ka hapa nui o 35 m-280 m, hiki ke hoʻokō i kahi mana ikaika o kēia manawa. Ke hoʻohālikelike ʻia me ka substrate aluminika, hiki i ka substrate keleawe ke hoʻokō i ka hopena dissipation wela ʻoi aku ka maikaʻi, i mea e hōʻoia ai i ka paʻa o ka huahana.

Kapili o Aluminum PCB

Kaapuni Kaapuni

Hoʻokumu ʻia ka papa keleawe kaapuni a kālai ʻia e hana i kahi kaapuni paʻi, hiki i ka substrate alumini ke lawe i kahi ʻoi aku ka kiʻekiʻe ma mua o ka FR-4 mānoanoa like a me ka laulā like.

Lapa hoʻomāmā

ʻO ka papa insulating ka ʻenehana koʻikoʻi o ka substrate aluminika, ka mea nui e pāʻani i nā hana o ka insulation a me ka conduction wela. ʻO ke alumini substrate insulating layer ʻo ia ka pale wela nui loa i ka ʻōnaehana module mana. ʻOi aku ka maikaʻi o ka conductivity thermal o ka papa insulating, ʻoi aku ka maikaʻi o ka hoʻolaha ʻana i ka wela i hana ʻia i ka wā o ka hana ʻana, a me ka haʻahaʻa o ka wela o ka hāmeʻa,

Pāpala metala

He aha ke ʻano metala e koho ai mākou e like me ka substrate metala insulating?

Pono mākou e noʻonoʻo i ka coefficient hoʻonui thermal, conductivity thermal, ikaika, paʻakikī, kaumaha, kūlana ʻili a me ke kumukūʻai o ka substrate metala.

ʻO ka maʻamau, ʻoi aku ka maikaʻi o ka alumini ma mua o ke keleawe. Loaʻa nā mea alumini 6061, 5052, 1060 a pēlā aku. Inā loaʻa nā koi kiʻekiʻe no ka conductivity thermal, nā waiwai mechanical, nā waiwai uila a me nā waiwai kūikawā ʻē aʻe, hiki ke hoʻohana ʻia nā pā keleawe, nā pā kila kila, nā pā hao a me nā pā kila silika.

Noi oMCPCB

1. Audio : Hoʻokomo, hoʻopuka puka, hoʻonui kaulike, hoʻonui leo, hoʻonui mana.

2. Mana Mana: Hoʻololi i ka mea hoʻoponopono, DC / AC converter, SW regulator, etc.

3. Kaʻa: Electronic regulator, ignition, power supply controller, etc.

4. Kamepiula: Papa CPU, floppy disk drive, lako mana, etc.

5. Nā Module Mana: Inverter, nā relays solid-state, nā alahaka hoʻoponopono.

6. Nā kukui a me nā kukui: nā kukui mālama ikehu, nā ʻano like ʻole o nā kukui LED hoʻōla ikehu, nā kukui o waho, nā kukui kahua, nā kukui punawai.