ʻO MCPCB ka pōkole o Metal core PCBs, me ka PCB i hoʻokumu ʻia i ka aluminika, ka PCB i hoʻokumu ʻia i ke keleawe a me ka PCB pili hao.
ʻO ka papa alumini ka mea maʻamau.Aia ka waihona kumu i kahi kumu alumini, FR4 maʻamau a me ke keleawe.Hōʻike ia i kahi papa lole wela e hoʻopau i ka wela ma kahi ala kūpono loa i ka wā e hoʻoluʻu ai i nā ʻāpana.I kēia manawa, manaʻo ʻia ʻo Aluminium Based PCB ka hopena i ka mana kiʻekiʻe.Hiki i ka papa hana alumini ke pani i ka papa seramika frangible, a hāʻawi ka alumini i ka ikaika a me ka paʻa i kahi huahana i hiki ʻole i nā kumu seramika.
ʻO ka substrate keleawe kekahi o nā substrate metala nui loa, a ʻoi aku ka maikaʻi o kāna conductivity thermal ma mua o nā substrate aluminika a me nā substrate hao.He kūpono ia no ka hoʻoheheʻe wela kiʻekiʻe loa o nā kaʻa kaʻa alapine kiʻekiʻe, nā ʻāpana i nā wahi me nā ʻano like ʻole o ka wela kiʻekiʻe a me ka haʻahaʻa a me nā lako kamaʻilio pololei.
ʻO ka papa insulation thermal kekahi o nā ʻāpana koʻikoʻi o ka substrate keleawe, no laila ʻo ka mānoanoa o ke keleawe keleawe ka hapa nui o 35 m-280 m, hiki ke hoʻokō i kahi hiki ke lawe i kēia manawa.Ke hoʻohālikelike ʻia me ka substrate aluminika, hiki i ka substrate keleawe ke hoʻokō i ka hopena dissipation wela ʻoi aku ka maikaʻi, i mea e hōʻoia ai i ka paʻa o ka huahana.
Kapili o Aluminum PCB
Kaapuni Kaapuni
Hoʻokumu ʻia ka papa keleawe kaapuni a kālai ʻia e hana i kahi kaapuni paʻi, hiki i ka substrate alumini ke lawe i kahi ʻoi aku ka kiʻekiʻe ma mua o ka FR-4 mānoanoa like a me ka laulā like.
Laena hoʻopololei
ʻO ka papa insulating ka ʻenehana koʻikoʻi o ka substrate aluminika, ka mea nui e pāʻani i nā hana o ka insulation a me ka conduction wela.ʻO ke alumini substrate insulating layer ʻo ia ka pale wela nui loa i ka hoʻolālā module mana.ʻOi aku ka maikaʻi o ka hana wela o ka papa insulating, ʻoi aku ka maikaʻi o ka hoʻolaha ʻana i ka wela i hana ʻia i ka wā o ka hana ʻana, a ʻo ka haʻahaʻa o ka wela o ka hāmeʻa,
Metala pani
He aha ke ʻano metala e koho ai mākou e like me ka substrate metala insulating?
Pono mākou e noʻonoʻo i ka coefficient hoʻonui thermal, conductivity thermal, ikaika, paʻakikī, kaumaha, kūlana ʻili a me ke kumukūʻai o ka substrate metala.
ʻO ka maʻamau, ʻoi aku ka maikaʻi o ka alumini ma mua o ke keleawe.Loaʻa nā mea alumini 6061, 5052, 1060 a pēlā aku.Inā loaʻa nā koi kiʻekiʻe no ka conductivity thermal, nā waiwai mechanical, nā waiwai uila a me nā mea kūikawā ʻē aʻe, hiki ke hoʻohana ʻia nā pā keleawe, nā pā kila kila, nā pā hao a me nā pā kila silika.
Noi oMCPCB
1. Leo : Hoʻokomo, hoʻopuka puka, hoʻonui kaulike, hoʻonui leo, hoʻonui mana.
2. Mana Mana: Hoʻololi i ka mea hoʻoponopono, DC / AC converter, SW regulator, etc.
3. Automobile: Electronic regulator, ignition, power supply controller, etc.
4. Kamepiula: Papa CPU, floppy disk drive, lako mana, etc.
5. Mana Module: Inverter, paa-moku'āina relays, rectifier alahaka.
6. Nā kukui a me nā kukui: nā kukui ho'ōla ikehu, nā ʻano like ʻole o nā kukui LED e mālama i ka ikehu, nā kukui o waho, nā kukui kahua, nā kukui punawai.
ʻAno metala: Ke kumu alumini
Ka helu o nā papa:1
Ili:HASL noa ke alakai
Ka mānoanoa o ka pā:1.5mm
Ka mānoanoa keleawe:35um
ʻO ka hoʻokō wela:8W/mk
Palena wela:0.015 ℃/W
ʻAno metala: Aluminumkumu
Ka helu o nā papa:2
Ili:OSP
Ka mānoanoa o ka pā:1.5mm
Ka mānoanoa keleawe: 35um
ʻAno kaʻina hana:Pāpaʻa keleawe hoʻokaʻawale Thermoelectric
ʻO ka hoʻokō wela:398W/mk
Palena wela:0.015 ℃/W
Manaʻo hoʻolālā:ʻO ke alakaʻi metala pololei, nui ka wahi hoʻopili keleawe, a liʻiliʻi ka uwea.
E noʻonoʻo i ka hāʻawi ʻana i nā hoʻonā mong pu no 5 mau makahiki.